Heres the theory and then my conclusion at the end...
A bar and plate IC will have a lower pressure drop than a tube fin. However, because the tubes have square leading and trailing edges, they tend to force cooling air around the core, rather than between the rows.
A tube fin of the same size and design will have a higher pressure drop because it has less volume inside the rows for charge air. However, since the leading and trailing edges of the tubes are rounded, they "channel" more air in between the rows.
Here's where tube fin comes out on top- make the core or the rows slightly larger than the bar and plate to make up the pressure drop difference and you'll have an IC that will flow as well as a bar/ plate, and will cool more efficiently because the rows are seeing more cooling air between them.
SOO in conclusion what im thinking is...because im on a budget build... i will just go with a smaller Bar Plate because im not going to be running huge numbers vs running the tube and fin and just buying a real big tube in fin that essentially is biggeer and better then the bar and plate...am i right or am i way off here